Bach 1.0 - Underfill Removal Blade
MACH BLADE SERIES - MA1.0 UNDERFILL REMOVAL BLADE This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process.
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Description
MACH BLADE SERIES - MA1.0 UNDERFILL REMOVAL BLADE This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process. 2mm blade easily copes with a variety of small size ic. 1. Heated by hot air gun, 2.
Cut the side edge of the blade and take it out
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