YCS Hight Temperature Solder Paste 199° (50g)
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Description
High-temperature solder paste with a 199℃ melting point for demanding reflow and rework applications Ideal for multilayer logic board repair, IC installation, pad restoration and high-heat microsoldering Produces strong, reliable solder joints capable of withstanding elevated operating temperatures Smooth, consistent application suitable for fine-pitch and micro-component work 50g container provides ample material for routine use in professional repair labs YCS solder paste formulated for stability and dependable performance under high heat
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