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Low-temperature solder paste with a 150℃ melting point for controlled reflow and repair work Ideal for heat-sensitive ICs, flex cables and multilayer mobile logic boards Reduces risk of overheating delicate components during microsoldering and IC installation Provides smooth application and reliable solder joints for fine-pitch components 50g container suitable for daily professional repair bench use YCS solder paste engineered for consistency, stability and clean low-heat performance
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