YCS Mid-layer General-purpose Tin Planting Platform For iPhone 16 Series
iPhone 16
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Compatibility & buying advice
Check that the exact model and connection match your device.
Technical specifications
- Compatible device brand
- Apple
- Compatible device model
- iPhone 16
Description
Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards Restores damaged or missing solder points across internal board layers Ensures accurate alignment during reconstruction of middle-layer solder pads Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series High-temperature resistant mesh optimized for professional microsoldering environments YCS mesh engineered for consistent accuracy in advanced board-level rework
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