Mechanic XG-Z40 Solder Tin Paste 183°C Melting Point
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Technical specifications
Description
The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
It is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue, so you are easy to clean the board
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