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Heat composition (greasy) for cooling helps heat diffusion from a CPU, chipset or processor to a cooler Excellent thermal resistance Perfect stability - not separating, running, migrating or bleeding Non-comparable…
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Heat composition (greasy) for cooling helps heat diffusion from a CPU, chipset or processor to a cooler Excellent thermal resistance Perfect stability - not separating, running, migrating or bleeding Non-comparable or electrically conductive Weight: 1.5 g Color: gray Thermal conductivity:> 4.5 W/mK Thermal resistance <0,205 ° C-in2 / W Density:> 2,5 Emulsion: <0,001 % Variable: <0,005 % Dielectric constant:> 5.1 Distribution factor: <0,005 Viscosity: 76 CPS Thizotropic index: 310 ± 10 ° C Operating temperature: -50 ~ 240 ° C Composite: 50% silicone compounds: 30% carbon
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