YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone 12 Series
iPhone 12
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Compatibility & buying advice
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Technical specifications
- Compatible device brand
- Apple
- Compatible device model
- iPhone 12
Description
Tin mesh designed for precise reballing of iPhone 12 Pro Max logic board solder pads Restores damaged or missing pad structures during IC and multilayer board repair Ensures accurate alignment and consistent solder distribution across reworked areas Ideal for CPU, PMIC and mid-layer module reballing on the iPhone 12 Pro Max High-temperature resistant mesh suitable for professional microsoldering workflows YCS mesh engineered for reliability and accuracy in board-level rework
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