YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone 13 Series
iPhone 13
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Compatibility & buying advice
Check that the exact model and connection match your device.
Technical specifications
- Compatible device brand
- Apple
- Compatible device model
- iPhone 13
Description
Tin mesh designed for precise reballing of iPhone 13 Pro Max logic board solder pads Restores damaged or missing pad structures during multilayer and IC-level repair Ensures accurate alignment and uniform solder distribution across reworked sections Ideal for CPU, PMIC and mid-layer component reballing on the iPhone 13 Pro Max High-temperature resistant mesh suitable for professional microsoldering tasks YCS mesh engineered for consistency, accuracy and durability in board-level rework
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