YCS Promax Mid-layer General-purpose Tin Planting Platform For iPhone 14 Series
iPhone 14
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Compatibility & buying advice
Check that the exact model and connection match your device.
Technical specifications
- Compatible device brand
- Apple
- Compatible device model
- iPhone 14
Description
Tin mesh designed for accurate reballing of iPhone 14 Pro and 14 Pro Max logic board solder pads Ensures precise restoration of pad structures during middle-layer and IC rework Improves alignment and consistency for CPU, PMIC and multilayer module repairs High-temperature resistant mesh suitable for professional microsoldering work Optimized for restoring missing or damaged solder points across internal board layers YCS mesh engineered for stable, reliable performance in advanced board-level repair
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