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iPhone X · iPhone 11
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Tin mesh designed for precise reballing of iPhone 11 Pro, 11 Pro Max and XS Max logic board solder pads Restores damaged or missing pad structures during IC replacement and multilayer board repair Ensures accurate alignment and consistent solder distribution across rebuilt sections Ideal for CPU, PMIC and mid-layer module reballing on the listed iPhone models High-temperature resistant mesh suitable for professional microsoldering workflows YCS mesh engineered for accuracy, durability and stable performance in board-level rework
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