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Strong magnetic base securely holds IC chips, stencils and small components in place during reballing and tinning Designed for precise chip positioning to improve accuracy and consistency in microsoldering work Ideal for BGA ICs and other small packages used in mobile phone, tablet and motherboard repair Flat work surface helps keep solder paste and tin distribution even across chip pads Reusable and durable construction suitable for daily use in professional repair labs YCS SLD01 model compatible with a wide range of common reballing and chip repair setups
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